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Si5915BDC
Vishay Siliconix
Dual P-Channel 8 V (D-S) MOSFET
PRODUCT SUMMARY
V DS (V) R DS(on) ( Ω )
0.070 at V GS = - 4.5 V
I D (A)
4 a
Q g (Typ.)
FEATURES
? Halogen-free According to IEC 61249-2-21
Definition
? TrenchFET ? Power MOSFET
-8
0.086 at V GS = - 2.5 V
0.145 at V GS = - 1.8 V
4 a
3.6
5 nC
? Low Thermal Resistance
? 40 % Smaller Footprint than TSOP-6
? Compliant to RoHS Directive 2002/95/EC
1206- 8 ChipFET ? (Dual)
APPLICATIONS
? Load Switch or Battery Switch for Portable Devices
D 1
S 1
G 1
1
S 1
S 2
D 1
S 2
Marking Code
G 1
G 2
D 2
G 2
DG
XXX
Lot Tracea b ility
D 2
Part #
Code
and Date Code
Bottom V ie w
Orderin g Information: Si5915BDC-T1-E3 (Lead (P b )-free)
D 1
P-Channel MOSFET
D 2
P-Channel MOSFET
Si5915BDC-T1-GE3 (Lead (P b )-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwi se noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
T C = 25 °C
Symbol
V DS
V GS
Limit
-8
±8
- 4 a
Unit
V
Continuous Drain Current (T J = 150 °C)
Pulsed Drain Current
Continuous Source-Drain Diode Current
T C = 70 °C
T A = 25 °C
T A = 70 °C
T C = 25 °C
T A = 25 °C
T C = 25 °C
I D
I DM
I S
- 4 a
- 4 a, b, c
- 3.2 b, c
- 10
- 4 a
- 1.9 b, c
3.1
A
Maximum Power Dissipation
T C = 70 °C
T A = 25 °C
P D
2
1.7 b, c
W
T A = 70 °C
1.1 b, c
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) d, e
T J , T stg
- 55 to 150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient
b, f
Maximum Junction-to-Foot (Drain)
t ≤ 5s
Steady State
R thJA
R thJF
62
33
74
40
°C/W
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See Solder Profile ( www.vishay.com/ppg?73257 ). The 1206-8 ChipFET is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 120 °C/W.
Document Number: 70484
S10-0548-Rev. B, 08-Mar-10
www.vishay.com
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